To stay on top of todays customer demands within the high-tech sector, companies must invest in new technologies and equipment. Circuit Tech has stayed true to its commitment to provide its strategic customers with in-house capability and process controls by acquiring and investing in future technologies to stay intune with the high-tech manufacturing demands of today and tomorrow.

We are very excited to offer the process of automated Conductive/ Non-Conductive Via fill as an in-house controlled process to our dedicated customers.

Circuit Tech has, as of September 1st, 2013, added the ITC Intercircuit automatic THP-35 via-fill processing equipment to its every growing technology adhancements.

This specialized process succcessfully allows us to fill holes, whether Blind or Through-Hole, for the process of via in pad technology. With the contiuned trend of electronic products becoming more compact and densely populated the realestate on todays PCB's is at a premium. Via in pad allows Engineers to utilitze the surface of thier boards more efficiently by combining these two elements of the design thus saving on board size and layer count.